英文字母(A)
access hole
acrylic resin
activating
additive process
adhesion promotion
adhesive
adhesive coated dielectric film
adhesive coated foil
adhesive face
anchoring spur
annealed copper foil
annular ring
arc resistance
aromatic polyamide paper
artwork master
as received
aspect ratio
A-stage resin
axial lead
英文字母(B)
backplane
backplane
base film surface
base material
base material thickness
basic dimension
basic grid
bellows contact
bias
bifurcated contact
binder
birdcage
bismaleimide-triazine resin
black oxidation
blank
bleading
blind via
blind via hole
blister
block diagram
blow hole
bomb sight
bond enhancing treatment
bond strength
bonding layer
bonding sheet
bow
bow of weave
break-away panel
breaking length
bright dip
brightener
brominated epoxy resin
B-stage resin
bulge
bump
buried via
buried via hole
burned plating
bus bar
英文字母(C)
camber
capacitive coupling
carrier foil
center to center spacing
ceramic substrate printed board
chamfer
characteristic impedance
chemical resistance
chip carrier
chip load
chip-on-board
circuit lager
circumferential separation
clad
clearance
clearance hole
clinched lead
clinched-wire through connection
coefficient of thermal expansion
cold flow
cold punching
cold solder connection
comparative tracking index
component density
component hole
component lead
component pin
component side
composite laminate
composite metallic material
composite test pattern
computer aided design
computer-aided drawing
conductive foil
conductive pattern
conductor
conductor base spacing
conductor base width
conductor layer
conductor layer No.1
conductor side
conductor spacing
conductor thickness
conductor width
conformal coating
connector area
contact angle
contact area
contact resistance、contact area
continuity
copper-clad laminate
copper-clad surface
corner mark
counterboring
countersinking
coupling agent
crack of foil
cracking
crazing
crazing of conformal coating
crease
cross wise direction
crossection area
crosshatching
cross-hatching
crosstalk
C-stage resin
curing agent
curing time
current-carrying capability
current-carrying capacity
cushion
cut-tosize panel
英文字母(D)
datum reference
daylight
deburr
definition
degassing
delamination
density
dent
design rule checking
design spacing of conductor
design width of conductor
desmear
dewetting
D-glass fibre
diazo film
dicyandiamide
dielectric breakdown
dielectric constant
dielectric dissipation factor
dielectric strength
dielectric withstanding voltage
differential etching
differential scanning caborimetry
digitizing
dimensional stabiliy
dimensioned hole
dip soldering
disturbed solder connection
double-sided copper-clad laminate
double-sided printed board
drag soldering
drilling
dross
dry film photoresist
dry film solder mask
dual-in-line package
dummy conductors
dummy land
英文字母(E)
edge board contact
edge spacing
edge-board connector
E-glass fibre
electrolytic cleaning
electrolytic corrosion test at edge
electromagnetic shielding
elongation
emulsion side
end missing
engineering drawing
epoxy resin
epoxy value
etch factor
etchant
etchback
etchback shadowing
etching
etching indicator
excess solder connection
exposure
external layer
extraneous copper
英文字母(F)
feather length
feed rate
feed rotation rate
fibre exposure
fiexible single-sided printed board
finish level
finished fabric
fish eye
flame retardant
flaming combustion
flammability
flare
flat package
flexible copper-clad dielectric film
flexible double-sided printed board
flexible multilayer printed board
flexible printed board
flex-rigid double-sided printed board
flex-rigid multilayer printed board
flex-rigid printed board
flexural strength
flip flop
flush conductor
flush printed board
flux
foil burr
foil profile
foil removal surface
from-to-list
fungus resistance
fusing
fusing fluid
英文字母(G)
gel
gel time
gelation particle
glass fabric
glass transition temperature
glowing combustion
gray scale
grey fabric
grid
ground
ground plane
ground plane clearance
英文字母(H)
haloing
haywire
heat resistance
heat shield
heat sink plane
height of capillary rise
high-pressure moulding
hole breakout
hole cleaning
hole density
hole location
hole pattern
hole void
hot air leveling
hot strength retention
英文字母(I)
i matt finish
imaging
impregnating
impregnating insulation paper
inclusion
infrared reflow soldering
in-ine test
inspection overlay
insufficient solder connection
interfacial connection
interlayer connection
internal identification mark
internal layer
ionizable zontaminant
英文字母(J)
英文字母(K)
英文字母(L)
laminate
laminate for additive process
laminate moulding plate
laminating
land
land pattern
landless hole
layer
layer-to-layer spacing
layup
lead extension
lead projection
lectrical bridging
lectrodeposited copper foil
legend
length wise direction;machine direction
leveling agent
lifted land
liquid photoresist
liquid photosensitive solder resist
logic diagram
low-pressure moulding
英文字母(M)
machinability
machine direction
manufacturing drawing
mark
mass lamination panel
master drawing
matte side
measling
mechanical wrap
melamine formaldehyde resin
metal core copper-clad laminate
metal core printed board
metal-clad base material
metal-clad laminate thickness
metallization
microetch
microsectioning
microstrip
minimum annular ring
minimum electrical spacing
mis-picks
mixed component mounting technlogy
mother board
moulding cycle
mounting hole
multilayer laminating
multilayer printed board
multiple pattern
multiple printed panel
multiple-image production master
multi-wiring printed board
mutilayer lay up
英文字母(N)
nail heading
negative
negative etchback
negative pattern
negative-acting resist
net list
nick
nodule
non-coductive pattern
nonfunctional interfacial connection
nonfunctional land
nonwetting
non-woven fabric
non-woven polyester fabric
英文字母(O)
offset land
opaquer
original production master
outgrowth
overhang
overheated solder connection
ovreplate
oxygen index
英文字母(P)
packaging and intercnnecting structure
packaging and interconnecting assembly
packaging density
pad
panel
panel plating
pattern
pattern plating
peck drilling
peel strength
perfluorinated ethylene-propylene copolymer film
permanent resist
phenolic resin
photo plotting
photo resist
photographic film
photographic reduction dimension
pin hole
pink ring
pit
pitch
placement
plain weave
plate finish
plated resist
plated through hole
plated-through hole structure test
plating
plating bar
plating resist
plating thief
plating up
polarization
polarizing slot
polyester resin
polyfunctional epoxy resin
polyimide resin
polytetrafluoetylene
positive
positive pattern
positive-acting resist
post cure
pot life
preferred solder connection
prepreg
prepreg cured thickness
press platen
press-fit contact
primary side
printed board
printed board assembly
printed board computer-aided design
printed board thickness
printed circuit
printed component
printed contact
printed wiring
printed wiring layout
printing
probe point
production board
production master
pull off strength
pull strength
pullout strength
pulse vacum tin remova
punching
英文字母(Q)
qfactor quaility conformance test circuit
英文字母(R)
rack of plating
rectangularity
reference dimension
reference edge
reflow soldering
register mark
registration
reinforcing material
release agent
release film
repairing
resin content
resin flow
resin recession
resin solder connection
resin-rich area
resin-starved area
resolution
reworking
right reading
right-angle edge connector
rigid double-sided printed board
rigid multilayer printed board
rigid printed board
rigid single-sided printed board
rolled copper foil
routing
rtwork
英文字母(S)
schematic diagram
scratch
screen printing
secondary side
self-extinguishing
semi-additive process
semi-manufactured mutilayer prited board panel
S-glass fibre
shear strength
shiny side
signal plane
silver film
single-image production master
single-sided copper-clad laminate
single-sided printed board
size
size content
size residue
sliver
solder
solder ball
solder bridging
solder connection
solder fillet
solder float test
solder leveling
solder mask ink
solder mask on bare copper
solder paste
solder plugs
solder prejection
solder resist
solder side
solder webbing
solder wicking
solderability
solderless wrap
span
splay
split
stain proofing
stencial
step drilling
step scale
step soldering
step-and-repeat
storage life
stress relief
strike
stripline
subtractive process
suface mount technology
supported hole
supporting plane
surface corrosion test
surface resistance
surface resistivity
surface-mount component(device)
swaged lead
英文字母(T)
tack time
tape automated bonding
taped components
tear strength
temperature index
tensile modules of elasticity
tensile strength
tenting
test board
test coupon
test pattern
thermal conductivity
thermal-mechanical analysis
thin copper foil
thin laminate
thixotopic
thread count
through-hole mounting
throwing power
tooling feature
total board thickness
transmission line
treated side
treatment transfer
trim line
tuching up
twist
twist of yarn
英文字母(U)
unclad laminate surface
undercut
undercut after process
undercut in process
unsaturated polyester
unsupported adhesive film
unsupported hole
英文字母(V)
vapor phase reflow soldering
via
visual examination
void
volatile content
voltage plane
voltage plane clearance
volume resistance
volumne resistivity
英文字母(W)
warp-wise
wave soldering
waviness
weave exposure
weave structure
weave texture
weft-wise-filling-wise
weight per epoxy equivalent
wet strength retention
wetting
wetting agent
whiskers
whitenness
wicking
woven scrim
wrinkle