英文字母(A)

access hole  acrylic resin  activating  additive process  adhesion promotion  adhesive
adhesive coated dielectric film  adhesive coated foil  adhesive face  anchoring spur
annealed copper foil  annular ring  arc resistance  aromatic polyamide paper  artwork master
as received  aspect ratio  A-stage resin  axial lead

英文字母(B)

backplane  backplane  base film surface  base material  base material thickness
basic dimension  basic grid  bellows contact  bias  bifurcated contact  binder  birdcage
bismaleimide-triazine resin  black oxidation  blank  bleading  blind via  blind via hole  blister
block diagram  blow hole  bomb sight  bond enhancing treatment  bond strength  bonding layer
bonding sheet  bow  bow of weave  break-away panel  breaking length  bright dip  brightener
brominated epoxy resin  B-stage resin  bulge  bump  buried via  buried via hole  burned plating
bus bar

英文字母(C)

camber  capacitive coupling  carrier foil  center to center spacing  ceramic substrate printed board
chamfer  characteristic impedance  chemical resistance  chip carrier  chip load  chip-on-board
circuit lager  circumferential separation  clad  clearance  clearance hole  clinched lead
clinched-wire through connection  coefficient of thermal expansion  cold flow  cold punching
cold solder connection  comparative tracking index  component density  component hole
component lead  component pin  component side  composite laminate
composite metallic material  composite test pattern  computer aided design  computer-aided drawing
conductive foil  conductive pattern  conductor  conductor base spacing  conductor base width
conductor layer  conductor layer No.1  conductor side  conductor spacing  conductor thickness
conductor width  conformal coating  connector area  contact angle  contact area
contact resistance、contact area  continuity  copper-clad laminate  copper-clad surface  corner mark
counterboring  countersinking  coupling agent  crack of foil  cracking  crazing
crazing of conformal coating  crease  cross wise direction  crossection area  crosshatching
cross-hatching  crosstalk  C-stage resin  curing agent  curing time  current-carrying capability
current-carrying capacity  cushion  cut-tosize panel

英文字母(D)

datum reference  daylight  deburr  definition  degassing  delamination  density  dent
design rule checking  design spacing of conductor  design width of conductor  desmear  dewetting
D-glass fibre  diazo film  dicyandiamide  dielectric breakdown  dielectric constant
dielectric dissipation factor  dielectric strength  dielectric withstanding voltage
differential etching  differential scanning caborimetry  digitizing  dimensional stabiliy  dimensioned hole
dip soldering  disturbed solder connection  double-sided copper-clad laminate
double-sided printed board  drag soldering  drilling  dross  dry film photoresist
dry film solder mask  dual-in-line package  dummy conductors  dummy land

英文字母(E)

edge board contact  edge spacing  edge-board connector  E-glass fibre  electrolytic cleaning
electrolytic corrosion test at edge  electromagnetic shielding  elongation  emulsion side
end missing  engineering drawing  epoxy resin  epoxy value  etch factor  etchant  etchback
etchback shadowing  etching  etching indicator  excess solder connection  exposure
external layer  extraneous copper

英文字母(F)

feather length  feed rate  feed rotation rate  fibre exposure  fiexible single-sided printed board
finish level  finished fabric  fish eye  flame retardant  flaming combustion  flammability  flare
flat package  flexible copper-clad dielectric film  flexible double-sided printed board
flexible multilayer printed board  flexible printed board  flex-rigid double-sided printed board
flex-rigid multilayer printed board  flex-rigid printed board  flexural strength  flip flop
flush conductor  flush printed board  flux  foil burr  foil profile  foil removal surface  from-to-list
fungus resistance  fusing  fusing fluid

英文字母(G)

gel  gel time  gelation particle  glass fabric  glass transition temperature  glowing combustion
gray scale  grey fabric  grid  ground  ground plane  ground plane clearance

英文字母(H)

haloing  haywire  heat resistance  heat shield  heat sink plane  height of capillary rise
high-pressure moulding  hole breakout  hole cleaning  hole density  hole location
hole pattern  hole void  hot air leveling  hot strength retention

英文字母(I)

i matt finish  imaging  impregnating  impregnating insulation paper  inclusion
infrared reflow soldering  in-ine test  inspection overlay  insufficient solder connection
interfacial connection  interlayer connection  internal identification mark  internal layer
ionizable zontaminant

英文字母(J)

jumper wire

英文字母(K)

key  keying slot  kiss pressure

英文字母(L)

laminate  laminate for additive process  laminate moulding plate  laminating  land  land pattern
landless hole  layer  layer-to-layer spacing  layup  lead extension  lead projection
lectrical bridging  lectrodeposited copper foil  legend  length wise direction;machine direction
leveling agent  lifted land  liquid photoresist  liquid photosensitive solder resist  logic diagram
low-pressure moulding

英文字母(M)

machinability  machine direction  manufacturing drawing  mark  mass lamination panel
master drawing  matte side  measling  mechanical wrap  melamine formaldehyde resin
metal core copper-clad laminate  metal core printed board  metal-clad base material
metal-clad laminate thickness  metallization  microetch  microsectioning  microstrip
minimum annular ring  minimum electrical spacing  mis-picks
mixed component mounting technlogy  mother board  moulding cycle
mounting hole  multilayer laminating  multilayer printed board  multiple pattern
multiple printed panel  multiple-image production master  multi-wiring printed board
mutilayer lay up

英文字母(N)

nail heading  negative  negative etchback  negative pattern  negative-acting resist  net list
nick  nodule  non-coductive pattern  nonfunctional interfacial connection  nonfunctional land
nonwetting  non-woven fabric  non-woven polyester fabric

英文字母(O)

offset land  opaquer  original production master  outgrowth  overhang
overheated solder connection  ovreplate  oxygen index

英文字母(P)

packaging and intercnnecting structure  packaging and interconnecting assembly
packaging density  pad  panel  panel plating  pattern  pattern plating  peck drilling
peel strength  perfluorinated ethylene-propylene copolymer film  permanent resist  phenolic resin
photo plotting  photo resist  photographic film  photographic reduction dimension  pin hole
pink ring  pit  pitch  placement  plain weave  plate finish  plated resist  plated through hole
plated-through hole structure test  plating  plating bar  plating resist  plating thief  plating up
polarization  polarizing slot  polyester resin  polyfunctional epoxy resin  polyimide resin
polytetrafluoetylene  positive  positive pattern  positive-acting resist  post cure  pot life
preferred solder connection  prepreg  prepreg cured thickness  press platen  press-fit contact
primary side  printed board  printed board assembly  printed board computer-aided design
printed board thickness  printed circuit  printed component  printed contact  printed wiring
printed wiring layout  printing  probe point  production board  production master
pull off strength  pull strength  pullout strength  pulse vacum tin remova  punching

英文字母(Q)

qfactor  quaility conformance test circuit

英文字母(R)

rack of plating  rectangularity  reference dimension  reference edge  reflow soldering
register mark  registration  reinforcing material  release agent  release film  repairing
resin content  resin flow  resin recession  resin solder connection
resin-rich area  resin-starved area
resolution  reworking  right reading  right-angle edge connector  rigid double-sided printed board
rigid multilayer printed board  rigid printed board  rigid single-sided printed board  rolled copper foil
routing  rtwork

英文字母(S)

schematic diagram  scratch  screen printing  secondary side  self-extinguishing
semi-additive process  semi-manufactured mutilayer prited board panel  S-glass fibre  shear strength
shiny side  signal plane  silver film  single-image production master
single-sided copper-clad laminate  single-sided printed board  size  size content  size residue  sliver
solder  solder ball  solder bridging  solder connection  solder fillet  solder float test
solder leveling  solder mask ink  solder mask on bare copper  solder paste  solder plugs
solder prejection  solder resist  solder side  solder webbing  solder wicking  solderability
solderless wrap  span  splay  split  stain proofing  stencial  step drilling  step scale
step soldering  step-and-repeat  storage life  stress relief  strike  stripline  subtractive process
suface mount technology  supported hole  supporting plane  surface corrosion test
surface resistance  surface resistivity  surface-mount component(device)  swaged lead

英文字母(T)

tack time  tape automated bonding  taped components  tear strength  temperature index
tensile modules of elasticity  tensile strength  tenting  test board  test coupon  test pattern
thermal conductivity  thermal-mechanical analysis  thin copper foil  thin laminate  thixotopic
thread count  through-hole mounting  throwing power  tooling feature  total board thickness
transmission line  treated side  treatment transfer  trim line  tuching up  twist  twist of yarn

英文字母(U)

unclad laminate surface  undercut  undercut after process  undercut in process
unsaturated polyester  unsupported adhesive film  unsupported hole

英文字母(V)

vapor phase reflow soldering  via  visual examination  void  volatile content  voltage plane
voltage plane clearance  volume resistance  volumne resistivity

英文字母(W)

warp-wise  wave soldering  waviness  weave exposure  weave structure  weave texture
weft-wise-filling-wise  weight per epoxy equivalent  wet strength retention  wetting
wetting agent  whiskers  whitenness  wicking  woven scrim  wrinkle